AI for Materials and Device Modeling

Ttitle:

AI for Materials and Device Modeling

Organization/Department

UW-EWU

Description of Project:

This offering includes three separate internship opportunities for students with strong backgrounds in physics or applied physics who are interested in exploring the use of artificial intelligence in materials and/or device modeling.

As part of the IEEE Nanotechnology Council Summer Internship, participants will work on developing and applying AI/ML techniques to model and analyze physical systems across different scales.

This position requires daily in-person meetings and full-time presence at the University of Washington, Seattle for the duration of the internship.

This project is part of the IEEE Nanotechnology Council Summer Internship.
Please read the Read Me page before applyinng

Requirements:

• The internship requires prior experience with machine learning tools, as well as strong programming and code development skills.
• This is a hands-on, research-focused experience involving regular collaboration with the team.
• Requires strong math skills.

Research Component:

If the student qualifies.

Grades:

US-resident high school students in grades 11-12 during the 2025-2026 school year.

Permanent Resident or US Citizens only.

Stipend:

No

Location:

In-person, Seattle, WA

Project Duration (Weeks) :

8

Project Weekly Commitment (Hours):

35

Project Start Date:

June 30, 2026.

Project Cost to attend if selected:

$250.00

Will be used to sponsor a scholarship for students from disadvantaged backgrounds.

Deadline to apply:

May 2, 2026 11:59 pm PST

To apply, go to the Mentorship Applicant Page